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  ? semiconductor components industries, llc, 2012 june, 2012 ? rev. 5 1 publication order number: mbrs3200t3/d mbrs3200t3g, NRVBS3200T3G surface mount schottky power rectifier this device employs the schottky barrier principle in a large area metal ? to ? silicon power diode. state ? of ? the ? art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. features ? small compact surface mountable package with j ? bend leads ? rectangular package for automated handling ? highly stable oxide passivated junction ? very high blocking voltage ? 200 v ? 175 c operating junction temperature ? guard ? ring for stress protection ? nrvb prefix for automotive and other applications requiring unique site and control change requirements: aec ? q101 qualified and ppap capable ? all packages are pb ? free* mechanical charactersistics ? case: epoxy, molded, epoxy meets ul 94, v ? 0 ? weight: 95 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? cathode polarity band ? device meets msl 1 requirements ? esd ratings: ? machine model = a ? human body model = 1c *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information smb case 403a plastic schottky barrier rectifier 3.0 ampere 200 volts http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbrs3200t3g smb (pb ? free) 2,500 / tape & reel b320 = specific device code a = assembly location y = year ww = work week  = pb ? free package (note: microdot may be in either location) ayww b320   marking diagram NRVBS3200T3G smb (pb ? free) 2,500 / tape & reel
mbrs3200t3g, NRVBS3200T3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (t l = 120 c) i f(av) 3.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction temperature t j ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 1) thermal resistance, junction ? to ? ambient (note 2) r  jl r  ja 13 62 c/w electrical characteristics maximum instantaneous forward voltage (note 3) (i f = 3.0 a, t j = 25 c) (i f = 4.0 a, t j = 25 c) (i f = 3.0 a, t j = 150 c) v f 0.84 0.86 0.59 v maximum instantaneous reverse current (note 3) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 150 c) i r 1.0 5.0 ma ma 1. minimum pad size (0.108 0.085 inch) for each lead on fr4 board. 2. 1 inch square pad size (1 0.5 inch) for each lead on fr4 board. 3. pulse test: pulse width = 300  s, duty cycle 2.0%. 100 1 0.1 1.0 0.2 0.3 0.4 0.5 0.6 0.7 v f , forward voltage (v) figure 1. typical forward voltage figure 2. maximum forward voltage 10 0.8 0.9 1.1 1.3 i f , forward current (a) t a = 25 c t a = 150 c 100 1 0.1 1.0 0.2 0.3 0.4 0.5 0.6 0.7 v f , forward voltage (v) 10 0.8 0.9 1.1 1.3 i f , forward current (a) t a = 25 c t a = 150 c 1.2 t a = 175 c t a = 175 c 1.2 t a = 100 c t a = 100 c
mbrs3200t3g, NRVBS3200T3G http://onsemi.com 3 1.0e ? 09 160 0 20 40 60 80 100 v r , reverse voltage (v) figure 3. typical reverse current 120 140 180 200 i r , reverse current (a) t a = 25 c t a = 150 c t a = 100 c 1.0e ? 08 1.0e ? 07 1.0e ? 06 1.0e ? 05 1.0e ? 04 1.0e ? 02 1.0e ? 09 160 0 20 40 60 80 100 v r , reverse voltage (v) figure 4. maximum reverse current 120 140 180 200 i r , reverse current (a) 1.0e ? 05 1.0e ? 04 1.0e ? 03 1.0e ? 07 1.0e ? 02 t a = 175 c 1.0e ? 03 t a = 25 c t a = 150 c t a = 100 c t a = 175 c 1.0e ? 06 1.0e ? 08 figure 5. typical capacitance 1000 10 160 0 20 40 60 80 100 v r , reverse voltage (v) 100 120 140 180 200 c, capacitance (pf) t c = 25 c f = 1 mhz typical capacitance at 0 v = 209 v 0 150 80 90 100 110 120 t l , lead temperature ( c) figure 6. current derating ? lead 130 140 180 i f , average forward current (a) 1 2 3 4 6 7 5 square wave dc figure 7. forward power dissipation 5 0 4 0123 i o , average forward current (a) 2.5 56 p fo , average power dissipation (w) 0.5 1 1.5 2 4.5 3 3.5 4 square wave dc 160 170 r  jl = 13 c/w
mbrs3200t3g, NRVBS3200T3G http://onsemi.com 4 package dimensions smb case 403a ? 03 issue h e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 2.261 0.089 2.743 0.108 2.159 0.085  mm inches  scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.90 2.20 2.28 0.075 inches a1 0.05 0.10 0.19 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.087 0.090 0.004 0.007 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrs3200t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative


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